PRODUCT

6-Slot High-Load Magazine Handling AMR

Specifically engineered for the heavy-duty requirements of semiconductor packaging and assembly, this model focuses on high-volume transport of lead frame or substrate carriers. Its key features include: High-Capacity Storage & Transport Equipped with 6 specialized magazine slots, this vehicle is designed to store and transport magazines for lead frames or substrates, offering a significantly larger payload capacity per mission. Optimized Deep-Reach Handling Featuring a long-reach collaborative robotic arm, the system is capable of extending precisely into the deep, narrow spaces of storage racks or equipment terminals to perform seamless magazine exchanges. Inter-Process Connectivity This solution is purpose-built to address the frequent transport needs in back-end assembly and testing, bridging the workflow between curing ovens, die bonders, and wire bonders. Autonomous Obstacle Avoidance & Navigation Leveraging advanced AMR autonomous mobility, the robot navigates flexibly through equipment-dense packaging and testing facilities. It effectively implements fully unmanned automation across the entire production line.